Advanced Semiconductor Materials and Devices

As the demand for faster, smaller, and more energy-efficient electronics continues to grow, the development of next-generation semiconductor materials becomes increasingly critical. Our research explores the integration of emerging semiconductor materials into advanced electronic and optoelectronic devices. We investigate novel material synthesis techniques to enable high-performance device fabrication on diverse substrates. By understanding and engineering the electronic properties at the atomic scale, we aim to improve device scalability, functionality, and energy efficiency for future applications in high-speed computing, flexible electronics, and neuromorphic systems.

Intelligent Sensor Systems

The next generation of sensors must do more than just detect—they must think. Our lab develops intelligent physical and chemical sensor systems that not only exhibit high sensitivity and reliability, but also integrate computational capabilities at or near the sensor node. These systems are designed for low-power, real-time monitoring in environments where energy efficiency and miniaturization are essential, such as in wearable healthcare technologies, edge AI platforms, and smart industrial infrastructure. We explore the co-design of novel sensing materials (e.g., piezoelectric, pyroelectric, and chemiresistive films) with embedded processing to enable in-sensor AI, paving the way for autonomous and context-aware sensing systems.

Freestanding Membranes and Heterogeneous 3D Integration

As conventional 2D system integration approaches reach limitations in interconnect density, design flexibility, and vertical scaling, our research explores new architectural paradigms enabled by freestanding single-crystalline membranes. By developing techniques to separate and transfer ultrathin functional materials from their growth substrates, we enable flexible stacking and bonding onto CMOS or other base circuits without compromising material quality. This platform not only addresses key challenges related to alignment, yield, and process compatibility in heterogeneous integration, but also expands design freedom across multiple device layers. We leverage these technologies to build multi-functional systems for RF communication, energy harvesting, and healthcare applications—demonstrating how freestanding materials can drive both "More Moore" and "More than Moore" advancements.